Monday, September 24, 2007

A new engineering plastic reduces electronic component malfunction due to m...

A new engineering plastic that markedly reduces the risk that electronic components will malfunction due to contact with moisture or oil has been introduced by BASF. The electrical conductive paths of these components can easily be overmolded with the plastic to form a tight seal.

For more details please click on the following link
http://plastemart.com/plasticnews_desc.asp?news_id=10912&P=P

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