Tuesday, December 23, 2008

Rohm and Haas, IBM enter joint development agreement for new semiconductor packaging materials

Rohm and Haas Electronic Materials, a leading supplier of materials for semiconductor packaging, has entered into a joint development agreement with IBM to develop, as well as evaluate, new materials for emerging packaging technologies.

For more details on Rohm and Haas, IBM enter joint development agreement for new semiconductor packaging materials click here

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