Wednesday, October 01, 2008

New nanoscopic materials to mitigate growth of tin whiskers from lead-free solders

The pioneer of POSS® (Polyhedral Oligomeric Silsesquioxanes) - Hybrid Plastics under sponsorship from The National Science Foundation, Electronics Division, has unveiled a first landmark conformal coaating, POSS® Short-Stop which is capable of suppressing tin whiskers from lead free solders and interconnects.

For more details on New nanoscopic materials to mitigate growth of tin whiskers from lead-free solders click here

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